Eliyan Corporation Delivers Industry's Highest-Performing Chiplet Interconnect PHY at 64Gbps in 3nm Process
Eliyan Corporation Delivers Industry's Highest-Performing Chiplet Interconnect PHY at 64Gbps in 3nm Process
Key Takeaways (TLDR)
Eliyan Corporation achieves industry’s highest performance chiplet interconnect at 64Gbps, doubling bandwidth for multi-die architectures.
Eliyan's NuLink™-2.0 PHY, manufactured in a 3nm process, supports standard and advanced packaging, improving Die-to-Memory bandwidth by over 2x.
Eliyan's breakthrough technology enables high-performance computing applications with reduced costs, manufacturing waste, and power consumption, benefiting various markets including aerospace, automotive, and industrial applications.
Eliyan's NuLink™-2.0 PHY achieves an industry milestone with the highest die-to-die PHY solution performance, further confirming the company's ability to extend die-to-die connectivity by 2x higher bandwidth.
Why it Matters
This news matters because Eliyan's breakthrough technology enables the industry’s highest performing chiplet interconnect for homogenous and heterogenous multi-die architectures, reducing costs, manufacturing waste, and power consumption. The milestone achievement also has applications in AI, HPC, gaming, aerospace, automotive, and industrial markets, impacting the future of high-performance computing applications.
Summary
Eliyan Corporation has successfully delivered the first silicon for its NuLink™-2.0 PHY, achieving a record-breaking 64Gbps per bump, doubling the industry's highest performance for die-to-die PHY solutions. This milestone confirms Eliyan's ability to extend die-to-die connectivity by 2x higher bandwidth, on standard as well as advanced packaging, at unprecedented power, area, and latency. The NuLink-2.0 PHY also supports standard and advanced packaging, improving Die-to-Memory bandwidth by over 2x using UMI technology, with applications in AI, HPC, and gaming, and reducing power and area requirements. The solution enables high-performance multi-die architectures at lower power and lower costs, making it suitable for various markets, including aerospace, automotive, and industrial applications.
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